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Die Attach System
芯片粘合设备
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Alphasem's new SWISSLINE 9022 "300mm" Die Attach System is the choice for leading edge applications which require the highest placement
accuracy, superior volumetric dispense control, most gentle die and substrate handling all combined with maximum productivity.
SWISSLINE 9022“300mm”的芯片粘合设备，适用于高精度要求、准确的银浆量控制，能在不同基材上粘合各种芯片的多功能粘片平台。特别是具有专利设计的wafer垂直放置，在拾取die的过程中可以减少粉尘对die的污染。 |
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The new EASYLINE 8032 Die Attach System from Alphasem is the solution of choice for high speed cost driven applications on metallic lead frames (SOIC, TSOP, PLCC,QFP, QFN, MLP, MLF, etc.)
EASYLINE
8032是为高速度，低成本的引线框架器件提供解决方案的芯片粘合设备。 |
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Alphasem is introducing the new EASYLINE 8088 for sensor assembly.
Applications such as pressure sensors, accelerometers,
gyroscopes and many more components related to the automotive,
biomedical and IT markets can now be efficiently processed.
新产品EASYLINE 8088是用于生产传感器芯片的粘合设备。 |
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Clip Attach 铜片贴装设备
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The EASYLINE 8033 is the answer for high speed cost driven clip attach application for power devices such as SOD,SMA,DPAK,TO 220 aso.
EASYLINE 8033适用于生产高速度、低成本、大功率的功率器件的铜片贴装设备。 |
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Die Sort 芯片分选机
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The Alphasem SWISSLINE 9021 is Alphasem’s solution for sorting up to 5 different die categories into waffle packs.(SOD,SMA,DPAK,TO22O etc.)
SWISSLINE
9021可将芯片装到5条编带或载盒的分选机。 |
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The EASYLINE 8031 is the cost-effective solution for sorting dice into waffle pack, jedec matrix trays or bonding onto artifical wafers.
EASYLINE 8031是具有较高价格/性能比的芯片分选机，它可以把芯片排序于编带或各类载片盒中。 |
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