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Batch Plasma Treatment System
Gas plasma treatment provides a fast, efficient method for surface treatment and cleaning prior to wire bonding, die attach, encapsulation, conformal coating and other processes.
Plasma processing enhances lamination bond strength, improves wire bond strength and
uniformity, promotes underfill adhesion and enhances die attach.
产品特点：
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灵活的处理方式（料盒、托盘、框架、晶元片） |
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广泛的应用领域：模块电子、BGAs、光电器件、柔性电路板、医疗器件、平面显示器件、多芯片模块、塑料产品、汽车电子等 |
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反应腔室：防化学腐蚀的不锈钢材质。多种方式的电极基板配置，可适用于Downstream和Direct
plasma应用 |
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RF13.56MHz中频射频技术，保证最佳离子密度和能量组合 |
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安全性：符合工业标准。紧急关机按钮可立即切断气流和射频电源，优质的观察玻璃可防止紫外线的辐射 |
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图形化的远程控制软件（可选） |
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Automated Plasma Treatment System
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Treatment uniformity across the product. A three-axis
symmetrical chamber ensures all positions of the product
are treated uniformly. |
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Consistency of treatment from product to product.
These systems feature tight controls over all the
process parameters to ensure repeatable results. |
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Proprietary software offers intuitive graphical interface
for easy touch-screen programming. Multiple access
levels provide security and added process control. Realtime
statistical data gathering is displayed in easy, quickglance
graphical format. |
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These systems are completely self-contained,
requiring minimal floor space. The pump,
generator and chamber are housed in a single enclosure.
Full front access allows for convenient maintenance of all
interior components. |
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