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| Uesd semiconductor equipment |
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| Fab |
| Lithography, Photoresist, Dry Etching Diffusion/Oxidation/Thermal(RTP/RTA, Traditional Furnace), CVD , PVD (Sputter), Evaporation Wet Process (Cleaning, Wet etching) Ion Implantation, CMP, Reticle/Photomask, Clean Roometc |
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| Assy |
| Grinding Die/Wire Bonding Molding/Packaging SMT Related, etc... |
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| Test System |
(Wafer) Prober
(Die) Handler, etc... |
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| FA/QA Instruction |
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