Offers world-class industry-standard atmospheric wafer handling robots, track systems and motion controllers;
Highly evolved designs with a cost saving alternative that can raise productivity levels and reduce operating costs;
State of the art, highly reliable robots are easily integrated into your equipment and utilize simple to use motion control software that offers exceptional reliability and unmatched versatility;
Working with semiconductor fabrication plants worldwide to increase the uptime of their existing equipment by replacing aged equipment with more reliable automation tools;
Legendary customer service, and with over 75 combined years of experience of expertise.

Wafer Handling Robots

MTBF 60,000 Hours
Vertical Travel 179 mm to 432 mm
Reach Up to 366 mm plus End Effector
Clean room Compatibility Class 1
Footprint Drop-in ATM Replacement
Repeatability +/- 0.025 mm
Motion Control Kernel 32-Bit, Real Time
Control Architecture Distributed Servo
Drive Mechanism Zero-Backslash Harmonic Drives
Cassette Mapper Available as Option

All-in-One Design:
Integraded motion controller, servo amplifier, and power supply within the robots cylindrical housing. No external controller or
interconnecting cabling.

Newly developed and fully backward compatible, the ATM-100, 300 & ATM-400 series atmospheric robots are a significant advancement in R-Theta-Z robot design and system architecture. Benefiting from the technological advances of today's components, the robots utilize lowinertia, quick response brushless servomotors. Coupled with zero-backlash Harmonic Drive® speed reducers, our robots offer greatly enhanced dexterity and precision. The innovative, class 1 compatible design incorporates the motion controller, servo amplifiers, and power supply within the robot's industry-standard cylindrical base. Our integrated design occupies less of your valuable manufacturing space.

The robot 32-bit, real-time kernel delivers accurate motion profiling along multiple path segments, and the distributed control architecture allows seamless integration with linear tracks, pre-aligners, and other sub-components. Networkable RS-485 and Ethernet interfaces complement the standard RS-232 and teach pendant connections. Comprehensive emulation of traditional robot "macro" commands offer a high level of compatibility with existing semiconductor tools. Powerful native wafer handling and scripting languages allow for simple integration of the robot into a wide variety of new automation applications.

The robots are offered with different radial reach capabilities. Standard arm links are 5.25" long, making total available reach equal to 10.50" plus end-effector length. If longer reaches are required, links of 7.20" are available. Z-axis vertical travel is 7" to 17". Additional options include multiple vacuum lines, a class 1 reflective laser scanner, S2 ready, and vacuum compatibility to 10-8 torr.
ATM 407 
300 MM WAFER
HANDLING ROBOT
ATM 405 
300 MM WAFER
HANDLING ROBOT
ATM 307 
200 MM WAFER
HANDLING ROBOT
ATM 305 
200 MM WAFER
HANDLING ROBOT
ATM 107 
200 MM WAFER
HANDLING ROBOT
ATM 105 
200 MM WAFER
HANDLING ROBOT
Integrated Controller & Power supply YES YES YES YES YES YES
Communications Interface RS232, RS485,
ETHERNET
RS232, RS485,
ETHERNET
RS232, RS485,
ETHERNET
RS232, RS485,
ETHERNET
RS232, RS485,
ETHERNET
RS232, RS485,
ETHERNET
Supply Voltage 115-240 VAC 50/60 Hz 115-240 VAC 50/60 Hz 115-240 VAC 50/60 Hz 115-240 VAC 50/60 Hz 115-240 VAC 50/60 Hz 115-240 VAC 50/60 Hz
Cassette Mapping Optional Optional Optional Optional Optional Optional
Macro Programmable YES YES YES YES YES YES
Repeatability 0.002 0.002 0.002 0.002 0.002 0.002
MTBF 60,000 hours 60,000 hours 60,000 hours 60,000 hours 60,000 hours 60,000 hours
Range of Motion Theta 360 no dead zone 360 no dead zone 360 no dead zone 360 no dead zone 360 no dead zone 360 no dead zone
Speed Z Axis 20 inches/sec 20 inches/sec 20 inches/sec 20 inches/sec 20 inches/sec 20 inches/sec
Speed Theta Axis 360 per sec 360 per sec 360 per sec 360 per sec 360 per sec 360 per sec
Speed Radial Axis 35" per sec 35" per sec 35" per sec 35" per sec 35" per sec 35" per sec
Robot Hole Diameter 11.5" 11.5" 9.75" 9.75" 8.5" 8.5"
Vacuum required 40.6 kpa - 54.2 kpa 40.6 kpa - 54.2 kpa 40.6 kpa - 54.2 kpa 40.6 kpa - 54.2 kpa 40.6 kpa - 54.2 kpa 40.6 kpa - 54.2 kpa
* The values shown are typical, please consult with the factory or refer to the website for additional information on existing and new products.
* For reference only
MODEL NUMBER STROKE HEIGHT BODY DIAMETER FLANGE DIAMETER
ATM 10X 7.12 [180.9] 17.62 [447.6] 7.95 [201.9] 10.00 [254]
ATM 30X 17.00 [431.8] 27.50 [698.6] 7.95 [201.9] 10.90 [276.9]
ATM 40X 13.11 [333] 21.93 [557] 10.83 [275] 13.00 [330.2]
ARM ASSEMBLIES
ATM 10X ATM 30X ATM 40X
ATM 105 ATM 107 ATM 305 ATM 307 ATM 405 ATM 407
A 3.38 [85.9] 3.38 [85.9] 3.31 [83.9] 3.31 [83.9] 3.40 [83.3] 3.40 [83.3]
B 2.18 [54.4] 2.18 [54.4] 2.10 [53.4] 2.10 [53.4] 2.20 [55.8] 2.20 [55.8]
C 1.40 [35.5] 3.79 [96.3] 0.95 [24.1] 3.34 [84.8] 0.10 [2.54] 2.29 [58.3]
D 1.46 [37] 1.57 [40] 1.46 [37] 1.57 [40] 1.46 [37] 1.57 [40]
E 1.70 [43.2] 2.05 [52] 1.70 [43.2] 2.05 [52] 1.70 [43.2] 2.05 [52]
F 5.10 [129.5] 7.22 [183.4] 5.10 [129.5] 7.22 [183.4] 5.10 [129.5] 7.22 [183.4]
Radius G 1.70 [43.2] 1.70 [43.2] 1.70 [43.2] 1.70 [43.2] 2.05 [52] 2.05 [52]
øH 2.91 [74] 2.91 [74] 2.91 [74] 2.91 [74] 1.57 [40] 1.57 [40]
REACH 10.20 [259.1] 14.44 [366.8] 10.20 [259.1] 14.44 [366.8] 10.20 [259.1] 14.44 [366.8]

Robot Positioning Track
The Robot Positioning Track is a low profile, wide footprint, linear motor powered enclosed positioning stage. Brushless linear motors offer unparalleled performance by producing extremely smooth and backlash-free motion. The magnetically preloaded dual parallel linear bearing rails with 4 linear recirculating ball bushing guides provide an extremely stable platform for the wafer handling robot. Available in travel lengths up to 160 inches, the robot positioning track is designed so that multiple independent in-line shuttles can be installed on the same track.

The Robot Positioning Track incorporates the latest in linear motion technology.
Motors: non-contact 3 phase brushless linear motor, commutated either sinusoidally or trapezoidally with Hall Effects. The encapsulated laminated
coil assembly moves and the multi-pole single sided permanent magnet assembly is stationary.

Bearings: Linear guidance is achieved by using two parallel linear rails with four linear recirculating ball bearing guides. Clean room compatible
lubricants are used to minimize particulate generation.

Encoders: Non-contact optical linear encoders with a reference mark for homing. Multiple reference marks are available and are spaced every 50
mm down the length of the scale. Typical encoder output is A and B square wave signals but sinusoidal output is available as an option

Limit Switches: End of travel limit switches are included at both ends of the stroke. The switches can be either active high (5V to 24V) or active
low. The switches can be used to shut down the amplifier or to signal the controller that an error has occurred.

Cable Carriers: Cable guidance is achieved by using a cable carrier. The cable carriers are oversized to allow for routing of the wafer robots hoses and cables. The back of the cable carrier can be easily removed and reattached to route through additional cables.

Bellows: The robot positioning track is offered with optional neoprene / nylon bellows with Mylar stiffeners. 12:1 extension to compression ratio.

Hard Stops: Hard stops are incorporated into the ends of the robot positioning track to prevent over travel damage in the event of servo system failure.

Mounting: The positioning table is designed for base mounting of the wafer robot.

Wafer Prealigner

Kinematics Rotating Vacuum Chuck
Horizontal Linear Axis for Offset Compensation
Vertical Linear Axis for Chuck Height Positioning
Alignment Repeatability Linear: +/-0.025 mm
Angular: +/-0.05 degrees
Maximum Offset Single Step Alignment: 12.5 mm
Two Step Alignment: 25 mm
Wafer Sizes 125 mm, 150 mm, 200 mm
Wafer Configurations Entire SEMI Flat and Notch Specification
Object Opacity Transparent, Semi-Transparent and Opaque Wafers
Drive System Ultra Low Inertia Brushless Motors on all Three Axes
Load Options Universal Chuck and Pin Loading
Detection Optical CCD, Non-Contact
Alignment Time Less than 3 Seconds
Cleanliness Class 1 Compatible
Power 115/230VAC, 50/60Hz, 65VA
Vacuum 500 mm Hg

The PA-200 Prealigner is an innovative,high precision, class 1 compatible solution including scanning electronics, motion controller and power supply within an industry standard footprint. This unique all-in-one design eliminates external controller and interconnecting cables while maintaining drop-in compatibility. All three axes are servo driven and equipped with ultra low inertia brushless motors for smooth, rapid response. 

The PA-200 Prealigner supports both chuck and pin load configurations without mechanical changes. The advanced scanning head is capable of detecting transparent, semi-transparent and opaque objects without repositioning between different wafer sizes. The built-in intelligent motion controller features a comprehensive set of commonly used commands to allow for the seamless integration of the prealigner into a variety of semiconductor platforms. The PA-200 is available in bottom-entry and side-entry cable configurations. The unprecedented aligning cycle time of less than three seconds allows for maximum throughput.
2002-2009 Copyright © Fantron Technologies