Atmospheric wafer handling robots, Track systems and motion controllers

	Offers world-class industry-standard atmospheric wafer handling robots, track systems and motion controllers;
	Highly evolved designs with a cost saving alternative that can raise productivity levels and reduce operating costs;
	State of the art, highly reliable robots are easily integrated into your equipment and utilize simple to use motion control software that offers exceptional reliability and unmatched versatility;
	Working with semiconductor fabrication plants worldwide to increase the uptime of their existing equipment by replacing aged equipment with more reliable automation tools;
	Legendary customer service, and with over 75 combined years of experience of expertise.

Wafer Handling Robots

MTBF	60,000 Hours
Vertical Travel	179 mm to 432 mm
Reach	Up to 366 mm plus End Effector
Clean room Compatibility	Class 1
Footprint	Drop-in ATM Replacement
Repeatability	+/- 0.025 mm
Motion Control Kernel	32-Bit, Real Time
Control Architecture	Distributed Servo
Drive Mechanism	Zero-Backslash Harmonic Drives
Cassette Mapper	Available as Option

All-in-One Design:
Integraded motion controller, servo amplifier, and power supply within the robot’s cylindrical housing. No external controller or
interconnecting cabling.

Newly developed and fully backward compatible, the ATM-100, 300 & ATM-400 series atmospheric robots are a significant advancement in R-Theta-Z robot design and system architecture. Benefiting from the technological advances of today's components, the robots utilize lowinertia, quick response brushless servomotors. Coupled with zero-backlash Harmonic Drive^® speed reducers, our robots offer greatly enhanced dexterity and precision. The innovative, class 1 compatible design incorporates the motion controller, servo amplifiers, and power supply within the robot's industry-standard cylindrical base. Our integrated design occupies less of your valuable manufacturing space.

The robot 32-bit, real-time kernel delivers accurate motion profiling along multiple path segments, and the distributed control architecture allows seamless integration with linear tracks, pre-aligners, and other sub-components. Networkable RS-485 and Ethernet interfaces complement the standard RS-232 and teach pendant connections. Comprehensive emulation of traditional robot "macro" commands offer a high level of compatibility with existing semiconductor tools. Powerful native wafer handling and scripting languages allow for simple integration of the robot into a wide variety of new automation applications.

The robots are offered with different radial reach capabilities. Standard arm links are 5.25" long, making total available reach equal to 10.50" plus end-effector length. If longer reaches are required, links of 7.20" are available. Z-axis vertical travel is 7" to 17". Additional options include multiple vacuum lines, a class 1 reflective laser scanner, S2 ready, and vacuum compatibility to 10^-8 torr.

	ATM 407 300 MM WAFER HANDLING ROBOT	ATM 405 300 MM WAFER HANDLING ROBOT	ATM 307 200 MM WAFER HANDLING ROBOT	ATM 305 200 MM WAFER HANDLING ROBOT	ATM 107 200 MM WAFER HANDLING ROBOT	ATM 105 200 MM WAFER HANDLING ROBOT
Integrated Controller & Power supply	YES	YES	YES	YES	YES	YES
Communications Interface	RS232, RS485, ETHERNET	RS232, RS485, ETHERNET	RS232, RS485, ETHERNET	RS232, RS485, ETHERNET	RS232, RS485, ETHERNET	RS232, RS485, ETHERNET
Supply Voltage	115-240 VAC 50/60 Hz	115-240 VAC 50/60 Hz	115-240 VAC 50/60 Hz	115-240 VAC 50/60 Hz	115-240 VAC 50/60 Hz	115-240 VAC 50/60 Hz
Cassette Mapping	Optional	Optional	Optional	Optional	Optional	Optional
Macro Programmable	YES	YES	YES	YES	YES	YES
Repeatability	±0.002	±0.002	±0.002	±0.002	±0.002	±0.002
MTBF	60,000 hours	60,000 hours	60,000 hours	60,000 hours	60,000 hours	60,000 hours
Range of Motion Theta	360° no dead zone	360° no dead zone	360° no dead zone	360° no dead zone	360° no dead zone	360° no dead zone
Speed Z Axis	20 inches/sec	20 inches/sec	20 inches/sec	20 inches/sec	20 inches/sec	20 inches/sec
Speed Theta Axis	360° per sec	360° per sec	360° per sec	360° per sec	360° per sec	360° per sec
Speed Radial Axis	35" per sec	35" per sec	35" per sec	35" per sec	35" per sec	35" per sec
Robot Hole Diameter	11.5"	11.5"	9.75"	9.75"	8.5"	8.5"
Vacuum required	40.6 kpa - 54.2 kpa	40.6 kpa - 54.2 kpa	40.6 kpa - 54.2 kpa	40.6 kpa - 54.2 kpa	40.6 kpa - 54.2 kpa	40.6 kpa - 54.2 kpa

* The values shown are typical, please consult with the factory or refer to the website for additional information on existing and new products.
* For reference only

MODEL NUMBER	STROKE	HEIGHT	BODY DIAMETER	FLANGE DIAMETER
ATM 10X	7.12 [180.9]	17.62 [447.6]	7.95 [201.9]	10.00 [254]
ATM 30X	17.00 [431.8]	27.50 [698.6]	7.95 [201.9]	10.90 [276.9]
ATM 40X	13.11 [333]	21.93 [557]	10.83 [275]	13.00 [330.2]

	ARM ASSEMBLIES
	ATM 10X		ATM 30X		ATM 40X
	ATM 105	ATM 107	ATM 305	ATM 307	ATM 405	ATM 407
A	3.38 [85.9]	3.38 [85.9]	3.31 [83.9]	3.31 [83.9]	3.40 [83.3]	3.40 [83.3]
B	2.18 [54.4]	2.18 [54.4]	2.10 [53.4]	2.10 [53.4]	2.20 [55.8]	2.20 [55.8]
C	1.40 [35.5]	3.79 [96.3]	0.95 [24.1]	3.34 [84.8]	0.10 [2.54]	2.29 [58.3]
D	1.46 [37]	1.57 [40]	1.46 [37]	1.57 [40]	1.46 [37]	1.57 [40]
E	1.70 [43.2]	2.05 [52]	1.70 [43.2]	2.05 [52]	1.70 [43.2]	2.05 [52]
F	5.10 [129.5]	7.22 [183.4]	5.10 [129.5]	7.22 [183.4]	5.10 [129.5]	7.22 [183.4]
Radius G	1.70 [43.2]	1.70 [43.2]	1.70 [43.2]	1.70 [43.2]	2.05 [52]	2.05 [52]
øH	2.91 [74]	2.91 [74]	2.91 [74]	2.91 [74]	1.57 [40]	1.57 [40]
REACH	10.20 [259.1]	14.44 [366.8]	10.20 [259.1]	14.44 [366.8]	10.20 [259.1]	14.44 [366.8]

Robot Positioning Track

The Robot Positioning Track is a low profile, wide footprint, linear motor powered enclosed positioning stage. Brushless linear motors offer unparalleled performance by producing extremely smooth and backlash-free motion. The magnetically preloaded dual parallel linear bearing rails with 4 linear recirculating ball bushing guides provide an extremely stable platform for the wafer handling robot. Available in travel lengths up to 160 inches, the robot positioning track is designed so that multiple independent in-line shuttles can be installed on the same track.

The Robot Positioning Track incorporates the latest in linear motion technology.

Motors: non-contact 3 phase brushless linear motor, commutated either sinusoidally or trapezoidally with Hall Effects. The encapsulated laminated
coil assembly moves and the multi-pole single sided permanent magnet assembly is stationary.

Bearings: Linear guidance is achieved by using two parallel linear rails with four linear recirculating ball bearing guides. Clean room compatible
lubricants are used to minimize particulate generation.

Encoders: Non-contact optical linear encoders with a reference mark for homing. Multiple reference marks are available and are spaced every 50
mm down the length of the scale. Typical encoder output is A and B square wave signals but sinusoidal output is available as an option

Limit Switches: End of travel limit switches are included at both ends of the stroke. The switches can be either active high (5V to 24V) or active
low. The switches can be used to shut down the amplifier or to signal the controller that an error has occurred.

Cable Carriers: Cable guidance is achieved by using a cable carrier. The cable carriers are oversized to allow for routing of the wafer robot’s hoses and cables. The back of the cable carrier can be easily removed and reattached to route through additional cables.

Bellows: The robot positioning track is offered with optional neoprene / nylon bellows with Mylar stiffeners. 12:1 extension to compression ratio.

Hard Stops: Hard stops are incorporated into the ends of the robot positioning track to prevent over travel damage in the event of servo system failure.

Mounting: The positioning table is designed for base mounting of the wafer robot.

Wafer Prealigner

Kinematics	Rotating Vacuum Chuck Horizontal Linear Axis for Offset Compensation Vertical Linear Axis for Chuck Height Positioning
Alignment Repeatability	Linear: +/-0.025 mm Angular: +/-0.05 degrees
Maximum Offset	Single Step Alignment: 12.5 mm Two Step Alignment: 25 mm
Wafer Sizes	125 mm, 150 mm, 200 mm
Wafer Configurations	Entire SEMI Flat and Notch Specification
Object Opacity	Transparent, Semi-Transparent and Opaque Wafers
Drive System	Ultra Low Inertia Brushless Motors on all Three Axes
Load Options	Universal Chuck and Pin Loading
Detection	Optical CCD, Non-Contact
Alignment Time	Less than 3 Seconds
Cleanliness	Class 1 Compatible
Power	115/230VAC, 50/60Hz, 65VA
Vacuum	500 mm Hg

The PA-200 Prealigner is an innovative,high precision, class 1 compatible solution including scanning electronics, motion controller and power supply within an industry standard footprint. This unique all-in-one design eliminates external controller and interconnecting cables while maintaining drop-in compatibility. All three axes are servo driven and equipped with ultra low inertia brushless motors for smooth, rapid response.

The PA-200 Prealigner supports both chuck and pin load configurations without mechanical changes. The advanced scanning head is capable of detecting transparent, semi-transparent and opaque objects without repositioning between different wafer sizes. The built-in intelligent motion controller features a comprehensive set of commonly used commands to allow for the seamless integration of the prealigner into a variety of semiconductor platforms. The PA-200 is available in bottom-entry and side-entry cable configurations. The unprecedented aligning cycle time of less than three seconds allows for maximum throughput.